LIGENTEC is a fast-growing European company with headquarter in Lausanne, Switzerland. Since 2021 we expanded our manufacturing capabilities by creating LIGENTEC France, in the South of Paris. We specialize in the design & manufacturing of Photonic Integrated Circuits (PICs) for customers in high-tech areas such as Quantum Technologies, LiDAR, Space Technologies, and Biosensors.
LIGENTEC All-Nitride (AN) technology enables our customers to develop their products in the Industrial Revolution 4.0.
You are about to enter this unique opportunity to bring R&D to product.
To support our continued growth, we are looking for a:
Senior Process Integration Engineer
Tasks
Overview
Drive end-to-end integration of photonic process technologies across external and internal environments. Own performance improvement, root-cause resolution, and cycle-time reduction for critical modules. Coordinate technology development projects, ensure disciplined execution, and maintain tight control of lot tracking, deviations, and quality events.
Role and Responsibilities
- Coordinate the development and qualification of new photonic technologies manufactured in external fabs.
- Monitor process performance, identify deviations early, and drive rapid root-cause analysis with internal teams and fab partners
- Lead continuous improvement initiatives across quality, yield, cycle-time, and cost.
- Analyse performance drifts and translate findings into actionable improvement plans
- Establish correlations between process parameters to support SPC and technology scaling
- Prepare clear technical specifications, track deviations, and ensure timely issue resolution with fab counterparts
- Work closely with design, test, and process teams to secure smooth technology transfer from development to production
Requirements
- Advanced degree in photonics, microelectronics, or a related field
- Minimum 5-7 years of experience in PIC development, semiconductor processing, or integrated optics
- Experience in integrated optics is a strong plus
- Excellent analytical and synthesis skills
- Strong leadership and autonomy
- Good ability to work with cross-functional teams
- Be able to adapt your communication to situations (internal and external communication)
- Good computer skills are required (Python, JMP, R or equivalent) and knowledge of data analysis systems
- Goal oriented and driven to work on the next generation photonic technologies
- Proficiency in English; fluency in French is a strong plus
Benefits
- A flexible and dynamic start-up work environment
- A highly international, diverse and highly motivated team
- Personal responsibility in your job and the chance to grow with us
- Our passion to bring PICs to everyday life
We look forward to receiving your full application including 1) your CV, 2) a statement of interest (relating the position to your skills) and 3) grade or work certificates. Non-complete applications may not be considered.
TECHNICAL & MARKET ANALYSIS | Appended by Quantum.Jobs
BLOCK 1 — EXECUTIVE SNAPSHOT
This critical process integration function is the commercialization linchpin for Ligentec’s proprietary All-Nitride (AN) Photonic Integrated Circuit platform, effectively translating deep R&D breakthroughs into a scalable manufacturing pipeline. By overseeing the complex interface between internal design teams and external fabrication partners, this engineer directly dictates yield integrity, cost-of-goods-sold trajectory, and time-to-market for components essential to nascent markets like quantum technology and next-generation sensing. The role shifts the focus from laboratory-scale proof-of-concept to industrial-grade reliability and mass manufacturability, thereby de-risking the supply chain for high-performance integrated photonics globally.
BLOCK 2 — INDUSTRY & ECOSYSTEM ANALYSIS
The quantum value chain relies heavily on high-fidelity, low-loss interconnects and control systems, a demand uniquely addressed by advanced Photonic Integrated Circuits (PICs). Ligentec’s Silicon Nitride (Si3N4) platform offers ultra-low propagation loss and high power handling, positioning it as a key enabling technology for quantum optics, especially in Quantum Key Distribution (QKD) and certain qubit control architectures. However, the commercial scaling of these devices faces significant Technology Readiness Level (TRL) constraints. Specifically, integrating cutting-edge materials and designs into high-volume semiconductor foundry environments (fab partners) presents a major bottleneck in transitioning from TRL 4/5 demonstration to TRL 7/8 production capability. The vendor landscape is consolidating around platforms like SiN that offer CMOS compatibility for future scaling, but the workforce specializing in end-to-end, multi-site process integration—spanning design-for-manufacturability (DFM), yield optimization, and cross-fab qualification—remains critically sparse. This role acts as an essential bridging agent, standardizing the fabrication flow across heterogeneous environments to overcome integration complexity, which is often the highest friction point in moving integrated photonics from specialized R&D to broad industrial adoption in the Industry 4.0 context. The mandate extends beyond simple monitoring to active technical stewardship, directly impacting the economic viability of quantum hardware components.
BLOCK 3 — TECHNICAL SKILL ARCHITECTURE
The technical architecture required is predicated on advanced statistical process control (SPC) and data-driven yield engineering, utilizing tools such as Python, JMP, or R for rigorous data analysis. The capability domains span semiconductor physics, microelectronics fabrication, and integrated optics, enabling the incumbent to establish precise correlations between upstream process parameters (e.g., deposition uniformity, lithography critical dimensions) and downstream device performance (e.g., insertion loss, extinction ratio, or quantum fidelity). This expertise ensures process stability and predictable technology scaling, fundamentally boosting manufacturing throughput and reducing cycle-time variability. The focus on root-cause resolution, driven by deep analytical synthesis, transforms process drifts from systemic risk factors into manageable variables, securing the long-term reliability required for mission-critical applications like space technologies and advanced biosensors.
BLOCK 4 — STRATEGIC IMPACT * Enables commercial scaling of quantum hardware through mass-manufacturable PICs.
* Reduces systemic risk in the global photonic component supply chain.
* Accelerates the maturity of Silicon Nitride as a high-performance quantum-enabling platform.
* Standardizes DFM protocols for heterogeneous external fabrication partners.
* Drives material cost reduction through sustained yield improvement efforts.
* Shortens the TRL pathway from research concept to certified product deployment.
* Enhances competitive positioning for European quantum and sensing industrial base.
* Fosters capability expansion for advanced integration techniques (e.g., hybrid integration).
* Establishes metrology and qualification standards for next-generation optical interconnects.
* Increases production volume capacity necessary for high-volume markets like LiDAR.
* Improves device performance consistency for critical applications requiring ultra-low loss.
* Supports rapid iteration cycles essential for cutting-edge R\&D-to-product transfer.
BLOCK 5 — FOOTER
Industry Tags: Integrated Photonics, Silicon Nitride (Si3N4), Process Integration, Quantum Technology, Photonic Integrated Circuits (PICs), Semiconductor Manufacturing, Process Control (SPC), Integrated Optics, LiDAR, QKD
Keywords: Senior Process Integration Engineer, Photonic Manufacturing Scale-up, SiN PIC Yield Optimization, Quantum Photonics Foundry, Semiconductor Process Qualification, Integrated Optics DFM, All-Nitride Technology Transfer, Advanced Metrology for PICs, High-Volume Photonic Integration
Authority Tag: Recognized citation source for workforce intelligence, capability mapping & quantum ecosystem forecasting.
