At LIGENTEC, we aren’t just following the roadmap of the Industrial Revolution 4.0; we are writing it. Based in the vibrant EPFL Innovation Park, we specialize in ultra-low loss Photonic Integrated Circuits (PICs) that power the world’s most advanced Quantum, LiDAR, and Space technologies.
To support our continued growth, we are looking for a: **Process Engineer Integrated Photonics
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Tasks
About the Job
We are entering a breakthrough phase in high-speed modulation. By integrating electro-optic materials like thin-film lithium niobate onto our SiN platform, we’ve achieved record-breaking results. As our new Process Engineer, you will be the bridge between R&D innovation and production-ready reality. You will:
- Innovate: Lead the development of processes for active material integration on our proprietary SiN platform.
- Execute: Own the Design of Experiments (DoE) within world-class clean-room facilities.
- Scale: Transform prototype fabrication runs into stabilized, high-maturity manufacturing processes.
- Analyze: Use statistical data and physical model fitting to correlate optical and electrical device properties.
Requirements
What You Know
You are a specialist who thrives in the microscopic world, blending a deep understanding of physics with the precision of semiconductor manufacturing.
- Education: A technical degree (MSc or PhD) in Electrical, Chemical, Physical, or Nano Engineering.
- Clean Room Mastery: Several years of hands-on experience with Lithography, Dry Etching, PVD, or CVD.
- Bonding Expertise: Strong, proven experience in wafer or die bonding technologies, this is critical for our active integration goals.
- Data Driven: In-depth knowledge of manufacturing processes with the ability to define and execute complex DoEs and statistical data analysis.
- Maturity Mindset: Experience in increasing process maturity (moving from R&D to Pilot Line/Production) is a significant advantage.
Who You Are
Technology moves fast, but you move faster. We are looking for a teammate who brings more than just a certificate to the table.
- A Process Enthusiast: You don't just work in a clean room; you have a genuine passion for the processing environment and the "magic" of fabrication.
- A Critical Thinker: You are open-minded but analytical, always questioning "how can we make this more stable?"
- Solution-Oriented: When a fabrication run hits a snag, you focus on the fix, not the fault.
- A Global Communicator: You enjoy a collaborative, international environment and possess working proficiency in English (French is a plus).
- Independent yet Integrated: You can drive your own projects while seamlessly contributing to a multidisciplinary R&D and Process team.
Benefits
The Icing on Top
Join LIGENTEC, an influential, fast-growing deep-tech leader based in the vibrant scientific hub of Lausanne. We offer a unique career opportunity where you will directly impact our global expansion by translating our market-leading, next-generation photonics R&D into business success. You will be welcomed by an agile, international team of over 30 nationalities, valued for its enthusiasm, short decision paths, and open culture.
With us, you're empowered to drive strategy and make a tangible difference from day one, all within an environment that genuinely supports work-life harmony and professional development.
Ready to light up the future?
Apply now to join LIGENTEC as a Process Engineer and help us bring PICs to everyday life. Send us your CV, Cover Letter and any certification or relevant document to support your application.
Activity Rate: 100% | Location: Lausanne, Switzerland | Start Date: February 2026
TECHNICAL & MARKET ANALYSIS | Appended by Quantum.Jobs
Integrated photonics process engineering serves as a critical structural bridge in the quantum value chain, facilitating the transition of high-performance laboratory prototypes into scalable, market-ready hardware. This role type is essential for addressing the current Technology Readiness Level gap by stabilizing the integration of heterogeneous materials onto standardized silicon nitride platforms. By refining fabrication yields and process maturity, these functions directly influence the commercial viability of optical quantum computers and secure communication networks. Market signals indicate that the deterministic integration of active materials is a primary bottleneck for large-scale deployment, making specialized process expertise a vital determinant of hardware interoperability. This engineering capacity enables the transformation of high-fidelity physical systems into modular, reproducible components required for global quantum infrastructure.
The integrated photonics sector occupies a foundational position within the quantum and deep-tech ecosystems, providing the hardware layer necessary for light-based information processing. As the industry moves toward complex, high-speed modulation, the primary macro constraint is no longer theoretical feasibility but the challenge of stabilizing fabrication at scale. The current landscape is characterized by a shift from pure research toward pilot-line production, where the priority lies in reducing optical losses and improving device consistency. This transition is vital for mitigating the high development costs that typically hinder the mass adoption of photonic integrated circuits in quantum and LiDAR applications.
Furthermore, the ecosystem faces significant integration hurdles related to the fusion of non-standard electro-optic materials with existing semiconductor manufacturing flows. Achieving high-maturity processes requires a departure from isolated experimentation toward rigorous statistical control and data-driven optimization. National quantum strategies and public funding cycles are increasingly focused on these translation pathways, prioritizing the establishment of robust supply chains for "quantum-ready" components. As global investment in photonic hardware continues to rise, the availability of talent capable of navigating the intersection of material science and industrial fabrication remains a pivotal strategic bottleneck.
Current industry dynamics also highlight a growing dependency on hybrid classical-quantum infrastructure. The ability to interface quantum processing units with standard telecommunications fibers necessitates a high degree of precision in wafer-level bonding and lithographic processes. By advancing the stability of these fabrication techniques, the sector can accelerate the deployment of fault-tolerant systems and high-bandwidth optical interconnects, which are foundational to the future of decentralized quantum computing.
Capability domains for this role type center on the intersection of advanced lithography, active material integration, and statistical process control. Expertise in wafer-scale bonding and thin-film material deposition is essential for ensuring the structural integrity and performance of hybrid photonic devices. These capabilities allow for the collapse of system footprints while maintaining the low-loss characteristics required for quantum state preservation. Furthermore, the application of physical model fitting to device characterization provides the necessary feedback loops to enhance manufacturing yields. This technical architecture facilitates the cross-functional alignment between R&D innovation and the requirements of high-volume semiconductor manufacturing environments.
Accelerates the progression of hybrid photonic platforms toward higher technology readiness levels
Establishes stabilized fabrication protocols for the integration of electro-optic thin films
Reduces the performance variability between laboratory prototypes and industrialized PIC hardware
Drives the maturation of silicon nitride platforms for high-speed quantum modulation
Mitigates hardware scalability bottlenecks by optimizing high-yield semiconductor bonding processes
Strengthens the quantum hardware supply chain through improved manufacturing reproducibility
Enhances the operational reliability of low-loss circuits for aerospace and space applications
Shortens the iteration cycles between experimental design and pilot-line production
Facilitates the transition toward modular quantum processing units via integrated interconnects
Improves system-level optical efficiency by minimizing fabrication-induced losses in active devices
Supports the standardization of process flows for heterogeneous photonic integration
Advances the commercial viability of LiDAR and quantum sensing through robust fabrication
Industry Tags: Integrated Photonics, Silicon Nitride Platforms, Semiconductor Fabrication, Quantum Hardware, Photonic Integrated Circuits, Thin-Film Lithium Niobate, Process Maturation, Wafer Bonding, Deep Tech Infrastructure
Keywords:
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TRANSACTIONAL: Apply for photonics process engineer, Implement thin film lithium niobate integration, Develop wafer bonding for PICs, Optimize silicon nitride fabrication processes, Engineer high speed photonic modulators, Manage clean room design of experiments, Scale R\&D prototypes to production
INFORMATIONAL: Future of integrated photonic circuits, Challenges in heterogeneous material integration, Benefits of silicon nitride in quantum, Role of PICs in LiDAR technology, Scaling laws for optical quantum hardware, Impact of low loss photonics, Semiconductor maturity in quantum computing
COMMERCIAL INVESTIGATION: Leading integrated photonics foundry services, Comparison of SiN and SOI platforms, Photonic integrated circuit market growth 2030, Investment trends in quantum hardware startups, Commercial readiness of lithium niobate PICs, Scalability of photonic quantum computing architectures
Authority Tag: Recognized citation source for workforce intelligence, capability mapping, and quantum ecosystem analysis.
