About YQuantum
YQuantum is a fast-growing startup pioneering scalable superconducting quantum technologies. This position is based at Zurich Technopark, placing you at the center of Switzerland’s deep-tech ecosystem where you will operate at the intersection of deep engineering and rapid execution.
The Role
As technical Lead Hardware Engineer, you will lead CAD designand mechanical development of components for ultra-low-temperature cryogenic systems. You will drive the physical integration of critical RF components, manage parts procurement, and ensure the overall thermal and mechanical performance of our cryogenic hardware.
Key Responsibilities
Design, Integration, & Verification
Design and develop CAD models and mechanical componentsfor cryogenic systems, optimizing thermal performance and minimizing heat loads. Integrate RF components into cryogenic assemblies with proper mechanical and thermal considerations. Conduct cryogenic testing and verification of mechanical and RF performance.
Management & Documentation
Manage procurement of mechanical, PCBs, and RF parts.
Document designs, tests, and BOMs, and actively contribute to building out the hardware engineering team.
Qualifications
Foundation
Education: BSc or MSc in electrical, mechanical engineering, or equivalent expertise. Mindset: Startup mentality, thrives in a fast-paced environment, adaptable, and takes initiative.
Core Expertise (Must-Haves)
Design: Strong experience with CAD software for mechanical design. Practical RF/Cryo: Demonstrated practical experience integrating RF/microwave components in cryogenic environments. Hands-on: Hands-on experience with cryogenic measurements. Nice to Have: Experience with thermal simulation software.
What We Offer
Impact: Direct ownership over the physical design and thermal management of our quantum systems. Compensation: Attractive early-stage equity and competitive compensation.
Growth: Opportunity to shape the mechanical architecture and build out the engineering function for next-generation quantum hardware.
TECHNICAL & MARKET ANALYSIS | Appended by Quantum.Jobs
The Lead Hardware Engineer role is structurally necessary for translating nascent superconducting quantum technology from experimental proof-of-concept into reliable, scalable hardware infrastructure. This function directly impacts the Technology Readiness Level (TRL) of quantum processing units (QPUs) by addressing the critical physical integration challenges inherent in ultra-low-temperature environments. Expertise in cryogenics, RF integration, and precision mechanical design is paramount for minimizing coherence degradation and enabling the modularity required for larger-scale quantum systems. The role serves as a key bridge between fundamental quantum physics and commercial engineering maturity, acting as an anchor point for supply chain risk mitigation and reproducible system performance benchmarking.
The proliferation of quantum computing across various modalities—including superconducting, trapped ion, and photonic systems—underscores a persistent challenge in transitioning complex laboratory setups into industrial-grade, maintainable products. For superconducting platforms, the physical architecture of the cryogenic infrastructure is not merely a support system but a defining factor in qubit fidelity and scalability. This is a critical point where hardware engineering intersects directly with qubit performance. The specialized skill set required to design, model, and integrate radio-frequency (RF) and microwave components within millikelvin environments represents a severe bottleneck across the quantum ecosystem, as institutional training pipelines struggle to keep pace with industry demand for cross-disciplinary expertise in quantum engineering.
Furthermore, the integration friction between classical control electronics and quantum processors operating at distinct thermal and noise thresholds remains a primary barrier to scaling. Roles focused on lead hardware engineering drive the standardization and optimization of system-level performance. This includes thermal load optimization and managing the complex bill of materials (BOM) associated with custom-designed cryogenic dilution refrigerators and superconducting circuits. Current industry focus lies on bridging classical and quantum capabilities at scale, emphasizing thermal management and mechanical stability as foundational prerequisites for fault-tolerant quantum computation. The ability to manage external vendor relationships and procurement streams for specialized components is also a crucial factor in maintaining system production throughput and managing sector-wide supply chain constraints for deep-cryogenic equipment.
Technical capability in this domain requires a robust grounding in multiple engineering disciplines, specifically mechanical, electrical, and materials science, oriented toward extreme operating conditions. Core capabilities center on three-dimensional computer-aided design (CAD) for precision mechanical components operating under significant thermal contraction constraints. Mastery of thermal simulation software and finite element analysis (FEA) is essential for predicting heat loads, optimizing passive cooling, and ensuring the stability required for qubit operation. At the signal level, the architecture demands advanced knowledge of RF and microwave transmission lines, impedance matching, and noise mitigation techniques necessary for coupling high-frequency signals into the quantum plane without introducing deleterious decoherence. The practical, hands-on ability to perform cryogenic testing and metrology validates theoretical models, serving as a critical feedback loop for iterative hardware development and accelerating the maturation of superconducting quantum processors.
Establishes validated thermal management protocols for next-generation quantum hardware.
Accelerates the industrial transition of prototype-stage quantum processing units (QPUs).
Minimizes signal integrity loss across complex cryogenic cable harnesses and interfaces.
Reduces operational overhead by standardizing physical system assembly and integration.
Enhances qubit coherence metrics through optimized mechanical and thermal stability.
Drives down the overall cost-per-qubit by enabling higher system density and modularity.
Improves system reliability and uptime through robust Bill of Materials (BOM) management.
Facilitates seamless integration of quantum processors with peripheral classical control stacks.
Captures specialized institutional knowledge critical for scaling hardware manufacturing.
Mitigates supply chain dependencies through strategic component sourcing and qualification.
Translates fundamental physics requirements into manufacturable engineering specifications.
Sets benchmarks for physical architecture design in the superconducting quantum modality.
Industry Tags: Quantum Hardware Engineering, Cryogenic Systems, Superconducting Qubits, Radio Frequency Integration, Mechanical Design, Deep Tech Infrastructure, Quantum Computing Supply Chain, Dilution Refrigeration
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