Own end-to-end three-dimensional (3D) computer-aided design (CAD) for cryogenic subassemblies and top-level mechanical integrations, including cold fingers, millikelvin (mK) and 4 kelvin (4 K) stages, radiation shields, vacuum interfaces, and cable or harness routing fixtures; create fully detailed two-dimensional (2D) drawings with geometric dimensioning and tolerancing (GD&T) and tolerance stackups. Build and steward the top assembly and bill of materials (BOM) by managing part numbering, configurations, engineering change order (ECO) and engineering change request (ECR) workflows, and product data management/product lifecycle management (PDM/PLM) toolchains such as SolidWorks, Windchill, and OnePDM. Lead Cryomechanical Engineering (CryoME) design reviews using standard review packages that include three-dimensional (3D) computer-aided design (CAD), two-dimensional (2D) drawings, critical-to-function specifications, materials, coatings, finishes, incoming quality control (IQC), cryogenic screening plans, manufacturing and assembly flows, risks, and schedules. Translate system requirements into mechanical specifications for thermal anchoring, heat-load budgets, coefficient of thermal expansion (CTE) mismatch management, vacuum sealing, vibration isolation, radio frequency (RF) and direct current (DC) cable management, and integration across temperature stages. Create SOPs by making detailed work instructions for installing parts, recording key data during installation and making sure that engineering intent is effectively communicated to engineers and technicians in the field. Drive design for manufacturing/design for excellence (DFM/DFX) with suppliers by generating clear build packages, supporting fabrication through first-article approval, dispositioning nonconformances with data-driven tolerance and fit assessments, and capturing as-built changes in drawings and bills of materials (BOMs). Embody our Culture and Values. Doctorate in Physics, Engineering, or related field AND 1+ year(s) experience in industry or in a research and development environment, could include completion of a post doctoral research position OR Master's Degree in Physics, Engineering, or related field AND 4+ years experience in industry or in a research and development environment OR Bachelor's Degree in Physics, Engineering, or related field AND 6+ years experience in industry or in a research and development environment OR equivalent experience. Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience OR equivalent experience CAD skills (Creo preferred): proven record creating complete 3D models from scratch and releasing production‑grade drawings. Deep experience in mechanical design skills - Proficiency driving complex designs involving mechanisms, multipart assemblies, commercial off-the-shelf (COTS) and custom component trade studies, and design for manufacturing and assembly (DFM/DFA) practices. PDM/PLM proficiency for configuration control and BOM accuracy (Windchill, OnePDM or similar). Design review leadership and clear documentation practices (review packages, checklists, risks, decisions, and release artifacts) per standardized, rigorous processes. Leadership and mentoring - Experience leading complex mechanical design efforts that require coordination across multiple contributors. Ability to assign work based on team members' skill levels, provide appropriate technical guidance and mentoring, and maintain accountability for successful delivery. 5+ year of experience integrating hardware inside dilution refrigerators across temperature stages, including millikelvin (mK) through 300 kelvin (K), thermal modeling or anchoring, and harnessing for radio frequency (RF) or direct current (DC) lines. 5+ year of experience using finite element analysis (FEA) or thermal simulation tools such as ANSYS Mechanical or COMSOL to guide design choices or validate the integrity of designs. 5+ year of hands-on cryogenic, vacuum, or ultra-high vacuum (UHV) hardware experience, including materials, coatings, finishes for cryogenic service, vacuum seals, thermal interfaces, wiring fixtures, or low-outgassing practices. 5+ year of experience partnering with suppliers or manufacturing teams to support precision machining, sheet metal, special processes, cleaning, vacuum bakeouts, cryogenic-compatible finishes, or first-article builds. 5+ years of experience operating within regulated or high-security lab environments and collaborating across distributed teams or sites. Experience contributing to inclusive, cross-disciplinary engineering teams by communicating decisions clearly, inviting diverse perspectives, and helping create an environment where team members can contribute effectively and succeed. 5+ Years Documenting, dispositioning and providing corrective action for hardware non-conformances. Ability to leverage artificial intelligence (AI) tools to drive innovation and efficiency (e.g., measurement, performance modeling and analysis, research gathering, day-to-day task automation). Ability to work in an "AI-first" environment using modern AI tools to accelerate discovery through hardware development.
QUANTUM ROLE CONTEXT | Appended by Quantum.Jobs v2
Role context:
This role exists to bridge high-level physical system requirements with detailed mechanical hardware realization in specialized research and development environments. Operating at the interface of systems engineering, thermal modeling, and physical manufacturing, the position turns conceptual cryogenic layouts into manufacturable assemblies. Professionals in this function establish configuration management, lead structured technical design reviews, and oversee supplier fabrication. By managing mechanical interfaces, thermal budgets, and product lifecycle workflows, the role ensures that complex physical infrastructure functions reliably across extreme temperature gradients.
Quantum ecosystem relevance:
The role provides critical enabling infrastructure for solid-state and superconducting quantum computing platforms operating at sub-kelvin temperatures. Quantum hardware requires specialized mechanical structures, vacuum sealing, and low-temperature thermal management to isolate sensitive physical qubits from ambient thermal noise. Positioned in hardware enablement, this function ensures that dilution refrigerator internals, wiring harnesses, and shielding assemblies maintain structural and thermal stability. This supports overall platform uptime, hardware repeatability, and accurate physical control essential for advancing scaled quantum processors.
Capability signals:
- Expertise in CAD modeling, technical drawing generation, and geometric dimensioning tolerances
- Advanced knowledge of cryogenic hardware integration across sub-kelvin and room temperature stages
- Proficiency managing complex bill of materials and product lifecycle change workflows
- Experience conducting finite element analysis for mechanical and thermal stress evaluations
- Technical leadership in design reviews and manufacturing package preparation for suppliers
