Develop and maintain robust assembly processes for quantum devices. Document processes and implementation across our global team. Drive external packaging material vendors to leverage existing supply chains to deliver solutions needed for packaging of quantum devices. Evaluate external packaging suppliers as scaling partners. Develop and implement test equipment and processes for evaluating packaging solutions Support development of advanced packaging technologies. Work in teams or independently as required. Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience These requirements include, but are not limited to the following specialized security screenings: Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable. Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience OR equivalent experience Experience managing outside vendors. Demonstrates the ability to work across multi-disciplinary teams and effectively communicate to meet deadlines and deliver results. Experience with industry standard packaging materials and processes. Experience in cryogenic materials. Experience in microwave device packaging. Ability to leverage AI tools to drive innovation and efficiency, e.g., performance modeling and analysis, research gathering, day-to-day task automation.
QUANTUM ROLE CONTEXT | Appended by Quantum.Jobs v2
Role context:
This role exists to bridge physical hardware design, material qualification, and external manufacturing workflows within specialized engineering operations. Positioned between internal hardware development teams and commercial component suppliers, the function establishes reliable assembly methods for delicate processing units. By evaluating structural materials and testing custom enclosures, engineers in this capacity transform experimental microelectronic designs into robust physical assemblies. They establish standardized assembly protocols that ensure hardware stability, thermal protection, and signal integrity across complex hardware operational lifecycles.
Quantum ecosystem relevance:
This function supports the quantum hardware enabling infrastructure by providing reliable physical enclosures for delicate quantum chips. As quantum processing systems scale, protecting sensitive devices from thermal and electromagnetic interference becomes critical. Packaging engineers bridge cleanroom device fabrication and practical system integration, ensuring specialized quantum components withstand extreme cryogenic conditions and high-frequency signal requirements. Their work with external material vendors enables the physical scaling and repeatable manufacturing required to transition quantum computing hardware from laboratory settings to commercial environments.
Capability signals:
- Extensive background in microelectronic packaging materials and standardized assembly processes
- Direct technical experience working with cryogenic environments and low-temperature material behavior
- Specialized knowledge in high-frequency microwave device packaging and signal protection
- Proven track record evaluating external hardware suppliers and managing vendor technical partnerships
- Practical experience developing custom test procedures and hardware evaluation systems
