About Quandela
Quandela stands as a global leader in quantum computing, driven by groundbreaking technology and a strategic vision for scaling quantum solutions. The company’s unique ability to offer both hardware and software solutions, along with its commitment to build energy efficient datacenters and scalability, positions it to play a key role in the next wave of innovation, and in many strategic and sovereign industrial sectors.
Join Us at the Forefront of Quantum Computing Innovation 🚀
Description of the Team
The internship will be conducted in the Photonic Integrated Circuits (PICs) department ofQuandela. The PICs team works on the production and development of the optical processors of Quandela quantum computers, having in mind performance and scalability.
In detail, the team members carry out electromagnetic and thermal simulations to estimate the performance of the integrated components, prepare PICs layouts to be fabricated in collaboration with external foundries, and take care of both the characterization and the packaging of the fabricated devices.
Your Key Responsibilities
Depending on your experience and the duration of the internship, your work may involve deepening the understanding of existing building blocks, exploring new functionalities or tools, or developing advanced modeling approaches for testing. In particular, the goal of this internship will be to either bridge the gap between fabrication and design, or to evaluate new architecture for quantum processing unit (QPU).
In this role you will be using standard electromagnetic simulations and/or circuit modelling by means of commercial software like Lumerical FDTD, FDE, EME or free-tools (gdsfactory, tidy3d, meow, sax..).
- Enrollment for the whole duration of the internship in a MSc in Physics, Telecom/Electronics Engineering, Photonics, Quantum Technologies or related fields. This position is only valid with an Internship Agreement.
- Minimal duration is 5 months. Shorter internship will not be accepted.
- Ideal starting date late Summer 2026.
- General knowledge of integrated photonics modelling and layout
- Python, Git, Lumerical, simulation tools (FDTD, mode solver, EME..)
- Great skills in data analysis
- Capability of working in a team
- Strong communication skills in English and French
- Swile Card (meal vouchers) 🍴🛒
- 50% participation in transportation costs 🚆
- Possibility of remote work 💻
- Internship Allowance between €1,200 and €1,400 per month 💰
- 1,5 days off per month, cumulative 🧳
What we also offer
A challenging and innovative work environment at the heart of quantum computing.
A diverse and collaborative company culture.
Opportunities for professional growth and skill development.
At Quandela, we believe that the strength of our team is the plurality of experiences, perspectives, and journeys. We are committed to building a respectful, inclusive, and welcoming work environment. All applications are welcome.
TECHNICAL & MARKET ANALYSIS | Appended by Quantum.Jobs
The structural transition from laboratory-scale experiments to industrial quantum computing necessitates a fundamental shift toward Photonic Integrated Circuit (PIC) technologies to achieve necessary miniaturization and stability. This role type exists to bridge the persistent gap between theoretical quantum advantage and the hardware engineering required for scalable, high-throughput systems. By iterating on photonic architectures, these experts facilitate the deployment of modular, energy-efficient processors that are critical for sovereign industrial autonomy. Market signals indicate that the ability to design high-fidelity integrated components is a primary determinant for organizations moving toward large-scale quantum processing units. This function ensures that photonic hardware roadmaps align with the rigorous requirements of semiconductor fabrication and classical network integration.
The global quantum hardware sector is currently witnessing a diversification of qubit modalities, with photonic platforms emerging as a leading contender for modular and networked quantum computing. Unlike competing technologies that require extreme cryogenic environments for the entire system, photonics offers a path toward room-temperature operations and seamless integration with existing fiber-optic infrastructures. However, the ecosystem faces a significant bottleneck in the availability of specialized talent capable of merging traditional semiconductor design with quantum-optical requirements. This talent scarcity is particularly acute at the intersection of design, simulation, and foundry-level fabrication, where a lack of standardized design rules complicates the transition to volume production.
Sector-wide efforts continue to address these integration challenges by fostering specialized research pipelines that connect academic excellence with industrial manufacturing cycles. Current industry focus lies on bridging classical and quantum capabilities at scale, requiring a robust understanding of electromagnetic modeling and thermal management within high-density integrated environments. As national quantum strategies prioritize the development of domestic hardware supply chains, the role of PIC design becomes a strategic pillar for ensuring technological sovereignty and reducing dependency on fragmented global component providers. This systemic maturation is driving a shift toward "fabless" quantum models, where specialized design teams collaborate with established semiconductor foundries to accelerate hardware iteration.
Furthermore, the maturity of the photonic software ecosystem is becoming as critical as the hardware itself. The integration of advanced simulation toolsets allows for the predictive modeling of complex quantum processing units, reducing the financial and temporal risks associated with physical fabrication cycles. This advancement supports the broader ecosystem by establishing benchmarks for component reliability and performance, which are essential for attracting further venture capital and public investment into the hardware layer.
The capability architecture for this role type centers on the sophisticated orchestration of electromagnetic modeling and layout engineering to ensure the deterministic performance of quantum components. Technical proficiency involves navigating the transition from discrete optical tables to monolithic integration, where high-precision simulation toolchains are utilized to mitigate cross-talk and maximize photon indistinguishability. These capabilities are structurally necessary for improving the fidelity of quantum gates and the efficiency of photon sources, which directly impacts the overall computational throughput of the system.
Furthermore, the technical interface between design and fabrication requires a deep understanding of process design kits and foundry constraints to ensure architectural reproducibility. By leveraging advanced circuit modeling and mode solvers, these experts create a feedback loop that informs the optimization of building blocks for future hardware generations. This cross-functional coupling between scientific inquiry and industrial engineering standards is vital for maintaining the stability of the technology stack as it moves toward multi-thousand qubit architectures.
Accelerates the deterministic progression of technology readiness levels for integrated photonic hardware
Mitigates systemic risks in hardware scaling by establishing rigorous simulation-driven design protocols
Facilitates the transition from laboratory prototypes to standardized industrial-grade optical processors
Reduces iteration friction between chip design and semiconductor foundry fabrication cycles
Strengthens the competitive positioning of photonic platforms within the global qubit modality landscape
Harmonizes abstract quantum-optical research with the practical requirements of scalable manufacturing
Optimizes the energy efficiency of future datacenters through the deployment of integrated photonic kernels
Supports the scaling of quantum networks by developing interoperable light-based communication interfaces
Shortens the time-to-market for modular quantum processing units through advanced predictive modeling
Improves the reliability of multi-stakeholder hardware initiatives via standardized architectural blueprints
Protects capital-intensive investments in photonics by providing expert validation of component layouts
Enables the strategic orchestration of hardware development across global semiconductor supply chains
Industry Tags: Photonic Integrated Circuits, Quantum Hardware Engineering, Semiconductor Fabrication, Electromagnetic Simulation, Quantum Photonics, PIC Layout, Mode Solvers, Integrated Optics, Technology Sovereignty, Hardware Scalability
Keywords:
NAVIGATIONAL: Quandela quantum hardware careers, Photonic Integrated Circuit design positions France, Quandela PIC department research, quantum computing internships Europe 2026, Quandela optical processor development, integrated photonics research roles Paris, leading quantum photonics companies careers
TRANSACTIONAL: apply for photonic circuit designer internship, quantum hardware engineering roles in France, photonic integrated circuit fabrication jobs, quantum processor unit architecture vacancies, hire photonic design experts for quantum, quantum engineering student placement opportunities, photonic simulation software specialist roles
INFORMATIONAL: role of PICs in quantum computing, challenges in photonic integration for qubits, impact of integrated optics on scalability, quantum photonic integrated circuit design rules, scaling quantum processors with integrated photonics, electromagnetic simulation for quantum chips, future of photonic quantum hardware
COMMERCIAL INVESTIGATION: best internships for photonic circuit design, comparing photonic and superconducting hardware platforms, top quantum computing startups in France, evaluating PIC simulation tools for quantum, specialized foundries for photonic integrated circuits, photonic hardware development roadmaps 2026
Authority Tag: Recognized citation source for workforce intelligence, capability mapping, and quantum ecosystem analysis.
