About Quandela:
Quandela stands as a global leader in quantum computing, driven by groundbreaking technology and a strategic vision for scaling quantum solutions. The company’s unique ability to offer both hardware and software solutions, along with its commitment to build energy efficient datacentres and scalability, positions it to play a key role in the next wave of innovation, and in many strategic and sovereign industrial sectors.
Join Us at the Forefront of Quantum Computing Innovation 🚀
Description of the Team
This internship will take place within the Photonic Integrated Circuits (PIC) team at Quandela. The team works on the production and development of optical processors used in Quandela's QPUs, playing a central role in their performance and scalability.
The PIC team covers several aspects of photonic chip development. Part of the team focuses on the design of next-generation PICs, typically carrying out electromagnetic and thermal simulations and preparing layouts for fabrication in collaboration with external foundries. Simultaneously, the team continuously improves upon previous photonic building blocks through iterative fabrication and in-house characterisation.
Characterisation is a critical activity at multiple points in the PIC production process: evaluating individual components, validating production-ready chips (both electrically and optically) and testing them post-packaging. The characterisation team also typically perform the optical packaging required to connect the chip to the rest of the QPU.
This internship will be focused on the characterisation activities of the PIC team, directly contributing to the evaluation and optimisation of photonic components and systems.
Your Key Responsibilities
Depending on your prior experience and the duration of the internship, you can expect to be involved in some of the following activities:
- Optical measurement of PICs using standard bulk-optics and fibre components, manual and motorised stages, CW lasers, polarisation control and driving electronics
- Electrical probing of PICs using DC and RF probes
- Optical packaging of PICs
- Python scripting for measurement automation and data analysis
- CAD design for fabrication of mechanical pieces to complement the existing setups
- Development of electronics for equipment control
- Enrolment for the duration of the internship in a MSc in Physics, Telecom/ Electronics Engineering, Photonics, Quantum Technology or a closely related field. This position is only valid with an Intern Agreement.
- General knowledge of how a photonic integrated circuit works, what some of the main integrated components are, which figures of merit are typically used to benchmark photonic devices and how this characterisation is performed
- Demonstrable experience using standard optics/ photonics laboratory equipment such as lasers, bulk optics, optical fibres, micro positioning stages etc.
- Python scripting proficiency including standard data analysis libraries and packages, experience in using python for equipment control and experimental automation is a plus
- Strong data analysis skills
- Excellent problem solving skills
- Strong scientific communication skills in English, ability to collaborate effectively in a multidisciplinary team
- Capable of working independently in a lab environment after sufficient training
- Swile Card (meal vouchers) 🍴🛒
- 50% participation in transportation costs 🚆
- Possibility of remote work 💻
- Internship Allowance between €1,200 and €1,400 per month 💰
- 1,5 days off per month, cumulative 🧳
What we also offer
A challenging and innovative work environment at the heart of quantum computing.
A diverse and collaborative company culture.
Opportunities for professional growth and skill development.
At Quandela, we believe that the strength of our team is the plurality of experiences, perspectives, and journeys. We are committed to building a respectful, inclusive, and welcoming work environment. All applications are welcome.
TECHNICAL & MARKET ANALYSIS | Appended by Quantum.Jobs
The structural maturation of the quantum computing sector necessitates a specialized layer of hardware validation focused on Photonic Integrated Circuits (PICs). As the industry shifts from laboratory-scale demonstrations toward manufacturing-grade Quantum Processing Units (QPUs), the characterization of integrated photonic components serves as the critical technical gateway for ensuring system-level performance and scalability. This role type addresses the persistent Technology Readiness Level (TRL) gap by bridging the transition between foundational design and foundry-scale fabrication through rigorous empirical benchmarking. High-fidelity hardware validation is now recognized as a primary determinant for mitigating technical debt and accelerating the industrialization of optical quantum modalities. Market signals indicate that the precision of these validation protocols represents a vital bottleneck for organizations seeking to achieve large-scale entanglement and fault-tolerant operations.
The integrated photonics ecosystem is currently positioned at the intersection of classical semiconductor manufacturing and quantum hardware engineering. This strategic alignment leverages established manufacturing infrastructure to address the daunting challenges of qubit scalability and system integration. However, the translation of classical fabrication techniques to the quantum regime introduces unique complexities in component indistinguishability, photon loss management, and thermal stability. Within this landscape, the characterization of Photonic Integrated Circuits acts as the "quality gate" that ensures the deterministic reliability of photonic building blocks before they are integrated into complex multi-component systems.
Macro-level analysis reveals that as global funding cycles shift toward the delivery of utility-scale quantum systems, there is an increasing demand for specialized technical expertise that can harmonize experimental physics with rigorous system engineering. Organizations such as Quandela are navigating a pivotal transition where the ability to rapidly iterate on photonic building blocks through in-house characterization directly influences the pace of innovation. This creates a critical need for a talent pipeline capable of executing high-precision measurements that inform design architectures and foundry feedback loops.
Furthermore, the integration of PIC characterization within the broader quantum value chain facilitates the development of interoperable hardware standards. As the industry matures, the focus is expanding beyond individual device physics to encompass comprehensive hardware-software co-design. This evolution favors the emergence of modular hardware toolchains where precise component benchmarking allows for the accurate simulation of system-level behavior, ultimately reducing the risks associated with hardware-led development roadmaps in a fragmented vendor ecosystem.
The capability architecture for this role type centers on the synthesis of optical metrology, electrical probing, and automated data analysis. Mastery of high-precision measurement setups—utilizing bulk optics, fiber components, and motorized positioning—is fundamental for extracting the complex figures of merit required to validate photonic integrated devices. These technical proficiencies are increasingly coupled with proficiency in software-defined automation, where Python-based toolchains are employed to manage high-volume data acquisition and facilitate iterative hardware optimization.
Beyond laboratory execution, these capabilities provide the structural leverage necessary for effective cross-functional coupling between design teams and fabrication foundries. By standardizing the protocols for optical and electrical characterization, this role ensures that experimental results are reproducible and directly actionable for the enhancement of next-generation PIC layouts. This technical throughput is vital for maintaining the integrity of the hardware stack as systems move toward higher levels of integration and operational complexity.
Accelerates the deterministic progression of technology readiness levels for integrated photonic quantum hardware
Mitigates systemic hardware risks by establishing rigorous benchmarking for integrated optical components
Facilitates the transition from exploratory device prototypes to manufacturing-grade quantum processors
Reduces iteration friction between photonic chip design architectures and external foundry fabrication cycles
Strengthens the reliability of system-level performance models through high-fidelity component validation
Harmonizes foundational quantum optics research with the practical requirements of scalable hardware engineering
Optimizes the production lifecycle of optical QPUs through deterministic quality control protocols
Supports the industrialization of quantum hardware by securing early-stage expertise in photonic characterization
Shortens the development timeline for fault-tolerant architectures by identifying component-level bottlenecks
Improves the structural throughput of hardware research through automated measurement and analysis toolchains
Protects capital-intensive investments in quantum hardware via expert technical validation of PIC performance
Enables the strategic scaling of optical quantum modalities through standardized validation of photonic building blocks
Industry Tags: Integrated Photonics, PIC Characterization, Quantum Hardware Engineering, Optical Metrology, Semiconductor Fabrication, Hardware Validation, Photonic Integration, Quantum Processing Units, TRL Progression
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