About Quandela
Quandela stands as a global leader in quantum computing, driven by groundbreaking technology and a strategic vision for scaling quantum solutions. The company’s unique ability to offer both hardware and software solutions, along with its commitment to build energy efficient datacenters and scalability, positions it to play a key role in the next wave of innovation, and in many strategic and sovereign industrial sectors.
Join Us at the Forefront of Quantum Computing Innovation 🚀
Description of the Team
The internship will be conducted in the Photonic Integrated Circuits (PICs) department of Quandela. The PICs team works on the production and development of the optical processors of Quandela quantum computers, having in mind performance and scalability. In detail, the team members carry out electromagnetic and thermal simulations to estimate the performance of the integrated components, prepare PICs layouts to be fabricated in collaboration with external foundries, and take care of both the characterization and the packaging of the fabricated devices.
Your Key Responsibilities
You will work on the cryogenic characterization and packaging of the integrated photonics building blocks that will be used in the next generation quantum photonic processors of Quandela.
In detail, the characterization will involve the measurement of the main properties of components such as straight waveguides, directional couplers, polarization integrated splitters/rotators, spot-size converters, and electro-optic phase shifters in different materials such as SiN and LNOI. The characterization will be performed at room temperature and at cryogenic temperature (2-4 K), which involves realizing the packaging of chips with cryogenic application constraints. The activity could involve CAD design with commercial software and coding with Python for instrumentation control and data analysis.
Depending on your previous experience and on the duration of the internship, you will be responsible of some of the following activities:
- Optical probing of PICs with optical fibers, fiber arrays, and lenses
- Electrical probing of PICs by DC and RF probes
- Characterization of PICs performance at cryogenic temperature
- PICs packaging (optical and electrical) at room and/or cryogenic temperature
- Use of manual and motorized translation stages for precise alignment between PICs and probes
- Use of continuous operation and closed cycle cryocooler
- Use of CW lasers, polarization optics and driving electronics
- Writing of Python scripts for running the measurements and analyzing the retrieved data
- CAD design for fabricating mechanical pieces
- Enrollment for the whole duration of the internship in a MSc in Physics, Telecom/Electronics Engineering, Photonics, Quantum Technologies or related fields. This position is only valid with an Internship Agreement.
- General knowledge of how a photonic integrated circuit works: which are the main integrated components, which are their required performances and how to characterize them
- Use of equipment commonly found in a photonic laboratory, such as lasers, bulk optics, fibers, alignment stages…
- Python proficiency for equipment control and automated characterization routines
- Great skills in data analysis
- Excellent problem-solving skills and ability to work in a fast-paced, dynamic environment
- Strong communication and collaboration skills, with the ability to work effectively in cross-functional teams
- Strong communication skills in English and French
- Capability of running autonomously basic experiments after proper training
- Knowledge/experience in RF electronics, superconducting single photon detectors, and cryogenics in general is a plus
- Swile Card (meal vouchers) 🍴🛒
- 50% participation in transportation costs 🚆
- Possibility of remote work 💻
- Internship Allowance between €1,200 and €1,400 per month 💰
- 1,5 days off per month, cumulative 🧳
What we also offer
A challenging and innovative work environment at the heart of quantum computing.
A diverse and collaborative company culture.
Opportunities for professional growth and skill development.
At Quandela, we believe that the strength of our team is the plurality of experiences, perspectives, and journeys. We are committed to building a respectful, inclusive, and welcoming work environment. All applications are welcome.
TECHNICAL & MARKET ANALYSIS | Appended by Quantum.Jobs
The structural maturation of quantum photonic systems necessitates a specialized technical tier focused on the empirical validation of Photonic Integrated Circuits (PICs) within extreme operating environments. As the industry transitions from room-temperature prototyping to cryogenic-scale deployment, the ability to characterize building blocks at millikelvin or low-kelvin stages becomes a primary determinant for hardware reliability and algorithmic fidelity. This role type addresses a critical bottleneck in the quantum hardware value chain where thermal stability and optical coupling efficiency directly impact the scalability of quantum processors. By bridging the gap between chip design and system-level performance, these functions ensure that photonic architectures meet the rigorous tolerances required for fault-tolerant computing. Current market signals indicate that expertise in cryogenic photonics is a high-scarcity capability, essential for organizations aiming to secure a first-mover advantage in the emerging photonic quantum economy.
The quantum hardware ecosystem is currently undergoing a shift toward modularity and high-volume fabrication, with silicon photonics and lithium niobate on insulator emerging as dominant material platforms. This evolution places a significant premium on the characterization and packaging layer of the value chain. At this stage, the transition from laboratory research to real-world deployment rests on the ability to stabilize fragile quantum states within robust physical architectures. Macro-level analysis suggests that the scaling of superconducting and photonic quantum computers is currently limited by the classical-quantum interface, specifically the microwave and optical interconnects that must function at near absolute zero.
Furthermore, the integration of PICs into existing high-performance computing infrastructures has become a national strategic imperative for major economies. This trend favors the development of modular hardware toolchains that can facilitate the offloading of specific computational kernels to quantum processors. As the industry moves toward the H2 2026 timeframe, the focus is pivoting toward establishing industrial-grade packaging standards that ensure long-term interoperability and reduce the risks associated with thermal expansion mismatches and signal loss. Addressing these technology readiness level gaps requires a workforce capable of navigating the intersection of material science, cryogenic engineering, and integrated optics.
Sector-wide efforts continue to address talent and integration challenges in quantum systems through specialized development pipelines. These initiatives are designed to cultivate a tier of experts who can manage the high-fidelity feedback loops between foundry fabrication and post-silicon validation. By standardizing the testing protocols for integrated components like directional couplers and phase shifters under cryogenic constraints, organizations can mitigate systemic risks associated with hardware failure in the fault-tolerant regime. This structural enablement is vital for maintaining the integrity of the quantum technology stack as hardware modalities diversify and scale.
The capability architecture for this role type centers on the convergence of integrated photonics, cryogenic instrumentation, and automated characterization workflows. Mastery of the interface between Photonic Integrated Circuits and external fiber-coupled systems is essential for ensuring optical power budgets are maintained within the thermal constraints of a dilution refrigerator or closed-cycle cryocooler. This technical proficiency is coupled with a deep understanding of the electro-optic behavior of materials such as silicon nitride and thin-film lithium niobate at low temperatures. Such capabilities are critical for the structural throughput of hardware development, as they directly influence the precision of qubit control and the efficiency of single-photon detection. Beyond bench-level validation, the role facilitates the coupling between chip-level layouts and system-level architectural blueprints. This ensures that abstract designs are translated into physical modules that can withstand the rigorous environmental demands of sub-kelvin operation. By standardizing the characterization of building blocks, these experts enable a level of operational readiness that allows the quantum ecosystem to transition toward modular, multi-chip architectures without compromising signal integrity or thermal stability.
Accelerates the deterministic progression of technology readiness levels for cryogenic photonic hardware modules
Mitigates systemic risks associated with thermal expansion and optical coupling failure in sub-kelvin environments
Facilitates the transition from room-temperature prototyping to standardized industrial-grade cryogenic packaging solutions
Reduces iteration friction in the hardware development cycle through high-fidelity empirical validation of PIC components
Strengthens the long-term competitive positioning of photonic quantum platforms by securing high-scarcity cryogenic expertise
Harmonizes integrated circuit design with the practical requirements of complex scalable quantum system architectures
Optimizes the lifecycle of photonic processors through the development of interoperable characterization protocols and tooling
Supports the scaling of quantum hardware by identifying performance bottlenecks at the classical-quantum interface
Shortens the time-to-market for fault-tolerant quantum computers by ensuring infrastructure alignment with fabrication roadmaps
Improves the reliability of multi-stakeholder hardware initiatives through the application of standardized cryogenic testing benchmarks
Protects capital-intensive investments in photonics by providing expert technical validation of foundry-fabricated integrated circuits
Enables the strategic orchestration of development efforts across global networks of fabrication foundries and research partners
Industry Tags: Quantum Photonics, Photonic Integrated Circuits, Cryogenic Engineering, Silicon Photonics, Hardware Validation, Lithium Niobate on Insulator, Quantum Hardware Value Chain, Characterization and Packaging
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